The effects of thickness and underlayer on both grain growth and internal stresses in Cu thin films

Materials Science Forum

Volumn 502, Issue , 2005, Pages 417-422

  Takayama, Shinji ^a   Oikawa, Makoto ^a  

^a NONE   (Japan)

Author keywords

Cu films; Grain growth; Hardness; Internal stress; Voids

Indexed keywords

COPPER; DEPOSITION; FILM THICKNESS; GRAIN GROWTH; HARDNESS; RESIDUAL STRESSES; THERMODYNAMIC STABILITY;

RESIDUAL INTERNAL STRESSES; THERMAL DEFECTS; VOIDS;

THIN FILMS;

EID: 34247257240     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-980-6.417     Document Type: Conference Paper

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