Thermal stability and internal stress for strongly (111) oriented Cu films

Materials Research Society Symposium - Proceedings

Volumn 795, Issue , 2003, Pages 235-240

  Takayama, Sinji ^a   Oikawa, Makato ^a   Himuro, Tokuji ^a  

^a HOSEI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; COPPER; ELASTIC MODULI; GRAIN SIZE AND SHAPE; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC STABILITY; ULSI CIRCUITS; X RAY DIFFRACTION; X RAY SCATTERING;

ELECTROMIGRATION (EM); GRAZING INCIDENCE X-RAY SCATTERING (GIXS); TEXTURE FILMS; THERMAL DEFECTS;

THIN FILMS;

EID: 2442417822     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-795-u5.11     Document Type: Conference Paper

References (10)

1. S. Vaidya and A. F. Shinha, Thin Solid Films, 75, 253 (1981).
2. W. C. Marra, P. Eisenberger, and A. Y. Cho, J. Appl. Phys. 50, 6927 (1970).
3. S. Brennan, Surf. Sci. 152/153, 1 (1985).
4. J. F. Nye: Physical Properties of Crystals (Oxford University Press, London, 2001) pp. 131-149.
5. D. Tabor., "The Hardness of Solid," Review of Physics in Technology, Vol. 1, 1970, pp.145-179.
6. C. V. Thompson, Script. Met., et Materia, 28, 167 (1993).
7. W. D. Nix, Met. Trans. 20A, 2217 (1989).
8. M. Murakami and T. Yogi: J. Appl. Phys. 57(2), 211 (1985).
9. R.W. Vook and F. Witt: J. Appl. Phys., 36, 2169 (1965).
10. M. D. Thouless, J. Gupta, and J. M. E. Harper, J. Mater. Res., 8 (8), 1845 (1993).