Aging characteristics and precipitate analysis of Cu-Ni-Mn-P alloy

Materials Science and Engineering: A

Volumn 458, Issue 1-2, 2007, Pages 295-302

  Choi, Joon Hwan ^a   Lee, Dong Nyung ^b  

^a Korea Institute of Machine and Materials   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

Copper alloy; Electrical conductivity; MnNiP; Precipitate; TEM

Indexed keywords

AGING OF MATERIALS; ELECTRIC CONDUCTIVITY; PRECIPITATES; STRUCTURE (COMPOSITION); TRANSMISSION ELECTRON MICROSCOPY;

AGING CHARACTERISTICS; MOLAR RATIO;

COPPER ALLOYS;

AGING OF MATERIALS; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; PRECIPITATES; STRUCTURE (COMPOSITION); TRANSMISSION ELECTRON MICROSCOPY;

EID: 34147150112     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.074     Document Type: Article

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