Analysis of precipitate structure in a Cu-Ni-P alloy

Scripta Materialia

Volumn 42, Issue 7, 2000, Pages 637-643

  Byun, Jung Soo ^a   Choi, Joon Hwan ^a   Lee, Dong Nyung ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COMPOSITION; CRYSTAL STRUCTURE; ELECTRIC CONDUCTIVITY OF SOLIDS; MORPHOLOGY; PRECIPITATION (CHEMICAL); TRANSMISSION ELECTRON MICROSCOPY;

COPPER NICKEL PHOSPHORUS ALLOY; PHOSPHIDE; PRECIPITATES;

COPPER ALLOYS;

EID: 0033878586     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(99)00405-4     Document Type: Article

References (12)

1. Bamford T.G. J. Inst. Metals. 33:1925;167.
2. Wise E.M. Trans. AIME. 78:1928;515.
3. Merica P.D. Trans. AIME. 99:1932;16.
4. Rollason E.C., Bamford T.G. Metals Alloys. 6:1935;345.
5. Crampton D.K., Burghoff H.L., Stacy J.T. Trans. AIME. 137:1940;354.
6. Miyake J., Fine M.E. Scripta Metall. Mater. 25:1991;1573.
7. Miyake J., Ghosh G., Fine M.E. MRS Bull. 21:1996;13.
8. Miyake J., Fine M.E. Acta Metall. Mater. 40:1992;733.
9. I. A. Voloshko, V. M. Rozenberg, Russ. Metall. No. 1, 155 (1983).
10. Rundqvist S. Acta Chem. Scand. 16:1962;992.
11. Choi J.H., Byun J.S., Lee D.N. J. Kor. Inst. Met. Mater. 37:1999;917.
12. Takahashi T., Kamio A., Murakami T., Tuzuku T. J. Jpn. Copper Brass Res. Assoc. 20:1981;128.