Pb electrodeposition on polycrystalline Cu in the presence and absence of Cl-: A combined oblique incidence reflectivity difference and in situ AFM study

Surface Science

Volumn 601, Issue 8, 2007, Pages 1886-1891

  Wu, Guang Yu ^a   Bae, S E ^b   Gewirth, A A ^b   Gray, J ^c   Zhu, X D ^c   Moffat, T P ^d   Schwarzacher, W ^a  

^a UNIVERSITY OF BRISTOL   (United Kingdom)

^b University of Illinois at Urbana Champaign   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Atomic force microscopy; Copper; Electrochemical methods; Electrochemical phenomena; Ellipsometry; Lead; Nucleation

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; ELECTRODEPOSITION; ELLIPSOMETRY; LEAD; MONOLAYERS; NUCLEATION;

ELECTROCHEMICAL METHODS; ELECTROCHEMICAL PHENOMENA; OBLIQUE INCIDENCE REFLECTIVITY DIFFERENCE (OI-RD); OVERPOTENTIAL-DEPOSITED (OPD) GROWTH;

POLYCRYSTALLINE MATERIALS;

EID: 34047266643     PISSN: 00396028     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.susc.2007.02.016     Document Type: Article

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