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Volumn 56, Issue 2, 2007, Pages 567-570
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Explanation for the ac-dc voltage transfer differences in thin-film multijunction thermal converters on silicon chips at high frequencies
a b c |
Author keywords
AC DC voltage transfer; Bond pads; High frequency; Silicon chip
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Indexed keywords
SEMICONDUCTING SILICON;
SEMICONDUCTOR JUNCTIONS;
THIN FILMS;
MULTIJUNCTION THERMAL CONVERTERS;
VOLTAGE TRANSFER;
VOLTAGE DISTRIBUTION MEASUREMENT;
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EID: 34047213279
PISSN: 00189456
EISSN: None
Source Type: Journal
DOI: 10.1109/TIM.2007.890798 Document Type: Conference Paper |
Times cited : (11)
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References (8)
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