Signal link-path characterization up to 20 GHz based on a stripline structure

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 2006, Pages 356-361

  Zhang, Jianmin ^a   Drewniak, James L ^a   Pommerenke, David J ^a   DuBroff, Richard E ^a   Yang, Zhiping ^b   Cheng, Wheling ^c   Fisher, John ^c   Camerlo, Sergio ^c  

^a University of Missouri Rolla   (United States)

^b APPLE INC   (United States)

^c CISCO SYSTEMS   (United States)

Author keywords

Debye dispersion law; Dielectric property; Genetic algorithms; Loss quantification; Signal link path characterization; Stripline; TEM wave; TRL de embedding

Indexed keywords

DEBYE DISPERSION LAW; LOSS QUANTIFICATION; SIGNAL LINK-PATH CHARACTERIZATION; TRL DE-EMBEDDING;

COMPUTER SIMULATION; DIELECTRIC LOSSES; ELECTRIC CONDUCTORS; ELECTRIC LINES; GENETIC ALGORITHMS; PARAMETER ESTIMATION; PERMITTIVITY;

STRIP TELECOMMUNICATION LINES;

EID: 34047193352     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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