Simulation of photoacoustic imaging of microcracks in silicon wafers using a structure-changeable multilayered thermal diffusion model

Applied Optics

Volumn 46, Issue 7, 2007, Pages 1019-1025

  Nakata, Toshihiko ^a   Kitamori, Takehiko ^b   Sawada, Tsuguo ^b  

^a HITACHI LTD   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MATHEMATICAL MODELS; MULTILAYER FILMS; PHOTOACOUSTIC SPECTROSCOPY; SILICON WAFERS; THERMAL DIFFUSION;

HEAT SOURCES; PHOTOACOUSTIC IMAGING; THERMAL DIFFUSION MODELS;

MICROCRACKS;

EID: 34047155187     PISSN: 1559128X     EISSN: 15394522     Source Type: Journal    
DOI: 10.1364/AO.46.001019     Document Type: Article

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