High-temperature residual stresses in thin films characterized by x-ray diffraction substrate curvature method

Review of Scientific Instruments

Volumn 78, Issue 3, 2007, Pages

  Keckes, J ^a,b   Eiper, E ^a,b   Martinschitz, K J ^a,b   Kostenbauer H ^a   Daniel, R ^a   Mitterer, C ^a  

^a UNIVERSITY OF LEOBEN   (Austria)

^b MATERIALS CENTER LEOBEN FORSCHUNG GMBH   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE EFFECTS; POLYCRYSTALLINE MATERIALS; RESIDUAL STRESSES; SILICON WAFERS; TITANIUM NITRIDE; X RAY DIFFRACTION ANALYSIS;

HEATING CHAMBERS; X-RAY DIFFRACTOMETERS;

THIN FILMS;

EID: 34047146495     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2535857     Document Type: Article

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