Role of thiourea additive in the electrodeposition process of nanocrystalline nickel and iron thin films

Revista de Chimie

Volumn 54, Issue 8, 2003, Pages 670-675

  Suliţanu, Nicolae ^a   Sandu, Ion ^a   Sandu, Ioan Gabriel ^b  

^a ALEXANDRU IOAN CUZA UNIVERSITY OF IASI   (Romania)

^b GHEORGHE ASACHI TECHNICAL UNIVERSITY OF IASI   (Romania)

Author keywords

Electrodeposition rate; Iron sulphur alloys; Nickel sulphur; Noncrystalline materials; Thin films

Indexed keywords

EID: 34047118771     PISSN: 00347752     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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