-
1
-
-
31144448162
-
Design Concept for Wire- Bonding Reliability Improvement by Optimizing Position in Power Devices
-
September
-
th International Conference on Power Semiconductors, Prague, 31 August - 3 September 2004, pp 39 44, 2004.
-
(2004)
th International Conference on Power Semiconductors, Prague, 31 August - 3
, pp. 39-44
-
-
Ishiko, M.1
Usui, M.2
Ohuchi, T.3
Shirai, M.4
-
2
-
-
85088735391
-
A Novel Electro-thermal Simulation Approach of Power IGBT modules for automotive traction applications
-
Kitakyushu
-
Takashi Kojima, Yasushi Yamada, Mauro Ciappa, Marco Chiavarin and Wolfgang Fichtner, "A Novel Electro-thermal Simulation Approach of Power IGBT modules for automotive traction applications" Proceeding of 2004 international symposium on power semiconductor devices &ICs, Kitakyushu, 2004.
-
(2004)
Proceeding of 2004 international symposium on power semiconductor devices &ICs
-
-
Kojima, T.1
Yamada, Y.2
Ciappa, M.3
Chiavarin, M.4
Fichtner, W.5
-
3
-
-
0031139774
-
-
H. Alan Mantooth, Allen R.Hefner, Electro thermal Simulation of an IGET PWM inverter, IEEE Transaction on Power Electronics, 12, no.3, May, 1997.
-
H. Alan Mantooth, Allen R.Hefner, "Electro thermal Simulation of an IGET PWM inverter", IEEE Transaction on Power Electronics, vol. 12, no.3, May, 1997.
-
-
-
-
5
-
-
12544254846
-
Electromagnetic Transient Simulation Models for Accurate Representation of Switching Losses and Thermal Performance in Power Electronic Systems
-
January
-
A. D. Rajapakse, A. M. Gole, and P. L. Wilson," Electromagnetic Transient Simulation Models for Accurate Representation of Switching Losses and Thermal Performance in Power Electronic Systems", IEEE Transactions on Power Delivery, vol.20, no.1, January 2005, pp 319-327, 2005.
-
(2005)
IEEE Transactions on Power Delivery
, vol.20
, Issue.1
, pp. 319-327
-
-
Rajapakse, A.D.1
Gole, A.M.2
Wilson, P.L.3
-
6
-
-
0036755126
-
Power Loss and Junction Temperature Analysis of Power Semiconductor Devices
-
September/October
-
Dewei Xu, Haiwei Lu, Lipei Hang, Satoshi Azuma, Masahiro Kimata, and Ryohel Uchida," Power Loss and Junction Temperature Analysis of Power Semiconductor Devices", IEEE Transaction on Industry Applications, vol..38, ,no.5, pp, 1426-1431, September/October, 2002.
-
(2002)
IEEE Transaction on Industry Applications
, vol.38
, Issue.5
, pp. 1426-1431
-
-
Xu, D.1
Lu, H.2
Hang, L.3
Azuma, S.4
Kimata, M.5
Uchida, R.6
-
7
-
-
33947614305
-
-
Introduction to the 600V ADD-A-pak™ and INT-A-pak™ IGBT Modules, International Rectifier Application notes, 1992.
-
Introduction to the 600V ADD-A-pak™ and INT-A-pak™ IGBT Modules, International Rectifier Application notes, 1992.
-
-
-
-
9
-
-
0036697722
-
New Physically-based PiN diode compact model for circuit applications
-
August
-
P.M.Igic, P.A.Mawby, M.S.Towers and S.Batcup, "New Physically-based PiN diode compact model for circuit applications", in IEE Proc-Circuit Devices Syst. Vol.149,No.4, August, 2002.
-
(2002)
IEE Proc-Circuit Devices Syst
, vol.149
, Issue.4
-
-
Igic, P.M.1
Mawby, P.A.2
Towers, M.S.3
Batcup, S.4
-
10
-
-
3242733690
-
Physically based 2D Compact Model for Power Bipolar Devices in International journal of Numerical Modelling Electronic Network
-
P. M. Igic, P.A.Mawby, M.S.Towers and S.Batcup, "Physically based 2D Compact Model for Power Bipolar Devices" in International journal of Numerical Modelling Electronic Network. Model;17:397-405, 2004.
-
(2004)
Model
, vol.17
, pp. 397-405
-
-
Igic, P.M.1
Mawby, P.A.2
Towers, M.S.3
Batcup, S.4
|