Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading

International Journal of Solids and Structures

Volumn 44, Issue 16, 2007, Pages 5247-5271

  Yuan, H ^a,b   Chen, J F ^c   Teng, J G ^a   Lu, X Z ^d  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b JINAN UNIVERSITY   (China)

^c UNIVERSITY OF EDINBURGH   (United Kingdom)

^d TSINGHUA UNIVERSITY   (China)

Author keywords

Bond; Concrete; FRP; Interfacial stress analysis; Peel test; Steel; Strengthening

Indexed keywords

BENDING STRENGTH; DEBONDING; ELASTIC MODULI; FIBER REINFORCED PLASTICS; PLATES (STRUCTURAL COMPONENTS);

INTERFACIAL NORMAL; INTERFACIAL STRESS ANALYSIS; PEEL TEST;

STRESS ANALYSIS;

EID: 33947627029     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2006.12.028     Document Type: Article

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