Fatigue behavior of nano-grained copper prepared by ECAP

Journal of Alloys and Compounds

Volumn 434-435, Issue SPEC. ISS., 2007, Pages 304-306

  Han, Seung Zeon ^a   Goto, Masahiro ^b   Lim, Chayong ^a   Kim, Chang Joo ^a   Kim, Sangshik ^c  

^a Korea Institute of Machine and Materials   (South Korea)

^b OITA UNIVERSITY   (Japan)

^c Gyeongsang National University   (South Korea)

Author keywords

Copper; ECAP; Fatigue; Fatigue damage; Nano grain

Indexed keywords

COPPER; CYCLIC LOADS; DEFORMATION; FATIGUE OF MATERIALS; SURFACE DEFECTS;

CYCLIC STRESSES; EQUAL CHANNEL ANGULAR PRESSING (ECAP); SURFACE DAMAGE;

NANOSTRUCTURED MATERIALS;

EID: 33947588584     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.08.179     Document Type: Article

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