Grain boundary distribution and texture in ultrafine-grained copper produced by severe plastic deformation

Scripta Materialia

Volumn 35, Issue 7, 1996, Pages 873-878

  Mishin, O V ^a,b   Gertsman, V Y ^b,c   Valiev, R Z ^b   Gottstein, G ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b INSTITUTE FOR METALS SUPERPLASTICITY PROBLEMS   (Russian Federation)

^c UNIVERSITY OF MANITOBA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; GRAIN GROWTH; HOT ROLLING; METALLOGRAPHIC MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; PLASTIC DEFORMATION; POLYCRYSTALLINE MATERIALS; SCANNING ELECTRON MICROSCOPY; STRAIN RATE; SUPERPLASTICITY; VOLUME FRACTION;

GRAIN BOUNDARY DISTRIBUTION; GRAIN BOUNDARY SLIDING; ULTRAFINE GRAINED COPPER;

COPPER METALLURGY;

EID: 0030269338     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/1359-6462(96)00222-9     Document Type: Article

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