Non-uniform UV curing effects on mechanical and fracture properties of organosilicate low-k thin films

Advanced Metallization Conference (AMC)

Volumn 2006, Issue , 2006, Pages 389-394

  Kim, Taek Soo ^a   Tsuji, Naoto ^b   Kemeling, Nathan ^b   Matsushita, Kiyohiro ^b   Dauskardt, Reinhold H ^a  

^a Stanford University   (United States)

^b ASM Japan   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ORGANOSILICATE LOW-K THIN FILMS; THIN-FILM GLASSES; ULTRAVIOLET (UV) RADIATION CURING;

ATOMIC FORCE MICROSCOPY; CURING; FRACTURE; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; ULTRAVIOLET RADIATION;

DIELECTRIC FILMS;

EID: 33947287267     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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