Infusion processing for reliable copper interconnects

Advanced Metallization Conference (AMC)

Volumn 2006, Issue , 2006, Pages 459-465

  Kondo, S ^a   Ishigami, T ^a   Enomoto, M ^a   Sherman, S ^b   Tabat, M ^b   Hautala, J ^b  

^a SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

^b Epion Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER WIRES; DIELECTRIC BARRIER DEPOSITION; INFUSION PROCESSING; STRESS-INDUCED VOIDING (SIV);

CHEMICAL VAPOR DEPOSITION; COPPER; DIELECTRIC PROPERTIES; ELECTRIC BREAKDOWN; ELECTROMIGRATION; SILICON NITRIDE; SILICON WAFERS;

SEMICONDUCTOR DEVICES;

EID: 33947283965     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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