High sputter bias super secondary grain growth initiation (in structures)

Advanced Metallization Conference (AMC)

Volumn 2006, Issue , 2006, Pages 97-103

  Vanstreels, Kris ^a,b   Brongersma, Sywert H ^b   D'Haen, Jan ^a,b   Demuynck, Steven ^b   De Ceuninck, Ward ^a,b   Caluwaerts, Rudi ^b   D'Olieslaeger, Marc ^a,b  

^a HASSELT UNIVERSITY   (Belgium)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; GRAIN SIZE AND SHAPE; PHASE COMPOSITION; SPUTTERING; THERMAL EFFECTS;

COPPER SPUTTERING; ROOM TEMPERATURE; SECONDARY GRAIN GROWTH; SUPER SECONDARY GRAINS;

GRAIN GROWTH;

EID: 33947262584     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. D. C. Edelstein, Proc. SPIE Conf, Multilevel Interconnect Technol. II 3508, 8 (1998).
2. M. E. Gross, K. Takahashi, C. Lingk, T. Riudorf, and K. Gibbons, Conf. Proc. ULSI XIV 1999, p. 51.
3. K. Vanstreels, S.H. Brongersma, S. Demuynck, J.D'Haen, W.De Ceuninck, M. D'Olieslaeger and K. Maex, Advanced Metallization conference, 2004 proceedings, p327-331.
4. K. Vanstreels, S. H. Brongersma, S. Demuynck, J. D'Haen, W. De Ceuninck, M. D'Olieslaeger and K. Macx, Advanced Metallization Conference, 2005 proceedigs, p615-621.