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Volumn 10, Issue 2, 2000, Pages 120-123

Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION; AUTOMOTIVE INDUSTRY; CMOS INTEGRATED CIRCUITS; COST EFFECTIVENESS; ELECTROPLATING; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; OPTICAL SWITCHES; RELIABILITY;

EID: 0033688283     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/10/2/304     Document Type: Article
Times cited : (107)

References (7)
  • 1
    • 0029213858 scopus 로고
    • Airbag application: A microsystem including a silicon capacitive accelerometer, CMOS switched capacitor electronics and true self-test capability
    • Zimmermann L, Ebersohl J P, Hund F L, Berry J P, Baillieu F, Rey P, Diem B, Renard S and Caillat P 1995 Airbag application: a microsystem including a silicon capacitive accelerometer, CMOS switched capacitor electronics and true self-test capability Sensors Actuators A 46/47 190-5
    • (1995) Sensors Actuators A , vol.46-47 , pp. 190-195
    • Zimmermann, L.1    Ebersohl, J.P.2    Hund, F.L.3    Berry, J.P.4    Baillieu, F.5    Rey, P.6    Diem, B.7    Renard, S.8    Caillat, P.9
  • 5
    • 0031177094 scopus 로고    scopus 로고
    • Low-temperature intermediate Au-Si wafer bonding eutectic or silicide bond
    • Wolffenbuttel R F 1997 Low-temperature intermediate Au-Si wafer bonding eutectic or silicide bond Sensors Actuators A 62 680-6
    • (1997) Sensors Actuators A , vol.62 , pp. 680-686
    • Wolffenbuttel, R.F.1
  • 6
    • 0343945519 scopus 로고    scopus 로고
    • Verkappung von sensorbauelementen mittels Niedertemperatur-Siliziumbonden
    • University of Bremen
    • Schulze S 1996 Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden Dissertation University of Bremen
    • (1996) Dissertation
    • Schulze, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.