BOILING JET IMPINGEMENT COOLING OF SIMULATED MICROELECTRONIC CHIPS.

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 28, Issue , 1983, Pages 5-12

  Ma, C F ^a   Bergles, A E ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

APPARATUS FOR HEAT TRANSFER STUDIES; BURNOUT HEAT FLUX; JET IMPINGEMENT BOILING; JET IMPINGEMENT COOLING OF SIMULATED MICROELECTRONIC CHIPS; NORMALLY IMPINGING CIRCULAR SUBMERGED JETS; SATURATED OR SUBCOOLED R-113;

INTEGRATED CIRCUITS;

EID: 0020995926     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)