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Volumn 2006, Issue , 2006, Pages 130-134

Optimization of thin film microcoolers for hot spot removal in packaged integrated circuit chips

Author keywords

Hot spot removal; Microcooler; Superlattice; Thermoelectric coolers

Indexed keywords

ELECTROTHERMAL MODEL; HOT SPOT REMOVAL; THERMOELECTRIC COOLERS; THIN FILM MICROCOOLERS;

EID: 33750106174     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (6)

References (22)
  • 2
    • 33750117601 scopus 로고    scopus 로고
    • Optimization of bulk thermoelectric modules for chip cooling applications
    • San Francisco, CA, July 17-22, Paper IPACK2005-73410
    • K. Fukutani, A. Shakouri, "Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications", Proceedings of InterPack2005, San Francisco, CA, July 17-22, Paper IPACK2005-73410,
    • Proceedings of InterPack2005
    • Fukutani, K.1    Shakouri, A.2
  • 5
    • 35949006143 scopus 로고
    • Thermoelectric figure of merit of a one-dimensional conductor
    • L. D. Hicks, M. S. Dresselhaus, "Thermoelectric figure of merit of a one-dimensional conductor", Phys. Rev. Lett., 47, pp. 16631, 1993.
    • (1993) Phys. Rev. Lett. , vol.47 , pp. 16631
    • Hicks, L.D.1    Dresselhaus, M.S.2
  • 6
    • 2142815781 scopus 로고    scopus 로고
    • Improved thermoelectric power factor in metal-based superlattices
    • D. Vashaee, A. Shakouri, "Improved Thermoelectric Power Factor in Metal-Based Superlattices", Phys. Pev. Lett., 92, pp. 106103, 2004.
    • (2004) Phys. Pev. Lett. , vol.92 , pp. 106103
    • Vashaee, D.1    Shakouri, A.2
  • 7
    • 0036537954 scopus 로고    scopus 로고
    • Heat transfer in nanostructures for solid-state energy conversion
    • G. Chen, A. Shakouri, "Heat transfer in nanostructures for solid-state energy conversion," Journal of Heat Transfer-Transactions of the ASME, vol.124, no.2, pp. 242-252, 2002.
    • (2002) Journal of Heat Transfer-transactions of the ASME , vol.124 , Issue.2 , pp. 242-252
    • Chen, G.1    Shakouri, A.2
  • 8
    • 0037183949 scopus 로고    scopus 로고
    • Quantum dot superlattice thermoelectric materials and devices
    • T.C. Harman, P.J. Taylor, M.P. Walsh, and B.E. LaForge, "Quantum Dot Superlattice Thermoelectric Materials and Devices", Science 297, pp. 2229-2232, 2002.
    • (2002) Science , vol.297 , pp. 2229-2232
    • Harman, T.C.1    Taylor, P.J.2    Walsh, M.P.3    LaForge, B.E.4
  • 12
    • 0002128489 scopus 로고
    • Closed-form equation for thermal constriction/spreading resistance with variable resistance boundary condition
    • S. Song, S. Lee, V. Au, "Closed-Form Equation for Thermal Constriction/Spreading Resistance with Variable Resistance Boundary Condition", IEPS Conference, pp. 111-121, 1994.
    • (1994) IEPS Conference , pp. 111-121
    • Song, S.1    Lee, S.2    Au, V.3
  • 14
    • 33750098065 scopus 로고    scopus 로고
    • K. Fukutani, Y. Zhang, A. Shakouri, to be published
    • K. Fukutani, Y. Zhang, A. Shakouri, to be published.
  • 17
    • 0036767710 scopus 로고    scopus 로고
    • Current and future miniature refrigeration cooling technologies for high power microelectronics
    • P. E. Phelan, V. A. Chiriac, T. Y. Lee, "Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics", IEEE Transaction on Components and Packaging Technologies, Vol. 25, No. 3, pp. 356-365, 2002.
    • (2002) IEEE Transaction on Components and Packaging Technologies , vol.25 , Issue.3 , pp. 356-365
    • Phelan, P.E.1    Chiriac, V.A.2    Lee, T.Y.3
  • 18
    • 0033694608 scopus 로고    scopus 로고
    • Optimization of the ArctiCooler for lowest thermal resistance in a minimum volume
    • G. Wagner, "Optimization of the ArctiCooler for Lowest Thermal Resistance in a Minimum Volume", Inter Society Conference on Thermal Phenomena, pp. 180-184, 2000.
    • (2000) Inter Society Conference on Thermal Phenomena , pp. 180-184
    • Wagner, G.1
  • 20
    • 0033740810 scopus 로고    scopus 로고
    • Application of thermoelectric cooling to elecric equipment: A review and analysis
    • R. Simons, R. Chu, "Application of Thermoelectric Cooling to Elecric Equipment: A Review and Analysis", 16th IEEE SEMI-THERM Symposium, pp. 1-9, 2000.
    • (2000) 16th IEEE SEMI-THERM Symposium , pp. 1-9
    • Simons, R.1    Chu, R.2
  • 21
    • 4444288943 scopus 로고    scopus 로고
    • Chip level refrigeration of portable electronic equipment using thermoelectric devices
    • Maui, HA, Jul 6-11, Paper IPACK2003-35305
    • G. Solbrekken, K. Yazawa, A Bar-Cohen, "Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices", Proceedings of InterPack2003, Maui, HA, Jul 6-11, Paper IPACK2003-35305,
    • Proceedings of InterPack2003
    • Solbrekken, G.1    Yazawa, K.2    Bar-Cohen, A.3
  • 22
    • 33750113411 scopus 로고    scopus 로고
    • An improved optimization approach for thermoelectric refrigeration applied to portable electronic equipment
    • San Francisco, CA, July 17-22, Paper IPACK2005-73190
    • R. Taylor, G. Solbrekken, "An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment", Proceedings of InterPack2005, San Francisco, CA, July 17-22, Paper IPACK2005-73190.
    • Proceedings of InterPack2005
    • Taylor, R.1    Solbrekken, G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.