Etching characteristics and modeling for oval-shaped contact

Thin Solid Films

Volumn 515, Issue 12, 2007, Pages 4923-4927

  Park, Sung Chan ^a   Lim, Seok Hyun ^a   Shin, Chul Ho ^a   Min, Gyung Jin ^a   Kang, Chang Jin ^a   Cho, Han Ku ^a   Moon, Joo Tae ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Bowing; Etching; Oval shape; Simulation

Indexed keywords

BENDING (FORMING); COMPUTER SIMULATION; ETCHING; IONS;

ION ACCUMULATION; OVAL SHAPE;

ELECTRIC CONTACTS;

EID: 33947198194     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.10.063     Document Type: Article

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