The effects of cavity size and incremental technique on micro-tensile bond strength of resin composite in Class I cavities

Dental Materials

Volumn 23, Issue 5, 2007, Pages 533-538

  He, Zhengdi ^a   Shimada, Yasushi ^a   Tagami, Junji ^a  

^a Graduate School ^*  (Japan)

Author keywords

C factor; Cavity size; Incremental technique; Micro tensile bond strength; Self etching primer

Indexed keywords

BOND STRENGTH (MATERIALS); DENTAL COMPOSITES; FILLING; TENSILE STRAIN;

C-FACTOR; CAVITY SIZE; INCREMENTAL TECHNIQUE; MICRO-TENSILE BOND STRENGTH; SELF-ETCHING PRIMERS;

RESINS;

ADHESIVE AGENT; BISPHENOL A BIS(2 HYDROXYPROPYL) ETHER DIMETHACRYLATE; CLEARFIL SE BOND; DENTIN BONDING AGENT; MACROGOL DERIVATIVE; POLYMETHACRYLIC ACID DERIVATIVE; RESIN; RESIN CEMENT; TRIETHYLENE GLYCOL DIMETHACRYLATE; UNCLASSIFIED DRUG; WATER;

ANIMAL; ARTICLE; CATTLE; CHEMISTRY; CLASSIFICATION; DENTAL BONDING; DENTAL SURGERY; DENTIN; LIGHT; MATERIALS TESTING; MECHANICAL STRESS; METHODOLOGY; RADIATION EXPOSURE; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY; TEMPERATURE; TENSILE STRENGTH; TIME; ULTRASTRUCTURE;

ADHESIVES; ANIMALS; BISPHENOL A-GLYCIDYL METHACRYLATE; CATTLE; COMPOSITE RESINS; DENTAL BONDING; DENTAL CAVITY PREPARATION; DENTIN; DENTIN-BONDING AGENTS; LIGHT; MATERIALS TESTING; MICROSCOPY, ELECTRON, SCANNING; POLYETHYLENE GLYCOLS; POLYMETHACRYLIC ACIDS; RESIN CEMENTS; STRESS, MECHANICAL; SURFACE PROPERTIES; TEMPERATURE; TENSILE STRENGTH; TIME FACTORS; WATER;

EID: 33947194030     PISSN: 01095641     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.dental.2006.03.012     Document Type: Article

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