Relationship between architecture, filament breakage and critical current decay in Nb3Sn composite wires repeatedly in-plane bent at room temperature

Superconductor Science and Technology

Volumn 19, Issue 4, 2006, Pages 323-332

  Badica, P ^a   Awaji, S ^a   Oguro, H ^a   Nishijima, G ^a   Watanabe, K ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRAIN; COMPOSITE WIRES; CRACK FORMATION; EDGE REINFORCEMENT; IN-PLANE; LONGITUDINAL DIRECTION; ROOM TEMPERATURE; SEMI-QUANTITATIVE ANALYSIS; TRANSVERSAL CRACKS;

COMPOSITE MICROMECHANICS; CRACKS; FILAMENTS (LAMP); HEAT TREATMENT; REINFORCEMENT; SCANNING ELECTRON MICROSCOPY; TIN;

WIRE;

EID: 33847788212     PISSN: 09532048     EISSN: 13616668     Source Type: Journal    
DOI: 10.1088/0953-2048/19/4/014     Document Type: Article

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