Low-cost epoxy packaging of CMOS Hall-effect compasses

Proceedings of IEEE Sensors

Volumn 2005, Issue , 2005, Pages 65-68

  Van Der Meer, Jeroen ^a   Riedijk, Frank ^a   Van Kampen, Edward ^a   Makinwa, Kofi ^b   Huijsing, Johan ^b  

^a Xensor Integration   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; GEOMAGNETISM; HALL EFFECT; PLASTIC MOLDS; STRESSES;

CMOS HALL SENSORS; EPOXY MOLDING; THERMAL SHOCK;

COMPASSES (MAGNETIC);

EID: 33847290903     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2005.1597638     Document Type: Conference Paper

References (6)

1. P. Munter, Spinning-current method for offset reduction in silicon Hall plates, Delft University Press, 1992.
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3. J.C van der Meer, F.R. Riedijk, P.C. de Jong, E.A. van Kampen, M.J. Meekel, J.H. Huijsing, "CMOS quad spinning-current Hall sensor system for compass application", Proceedings of the third IEEE Sensors Conference, p. 1434-1437, Vienna, 2004.
4. J. C. van der Meer, F. R. Riedijk, E. van Kampen, K. A. A. Makinwa, and J. H. Huijsing, A fully integrated CMOS Hall sensor with a 3.65μT 3σ offset for compass applications, Proceedings of the ISSCC, p246-247, San Francisco, California, 2005.
5. th Annual International Reliability Physics Symposium, San Jose, California, 2000.
6. S. McLean, S. Macmillan, S. Maus, V. Lesur, D.Dater and A Thompson, The US/UK World Magnetic Model for 2005/2010, NOAA Technical Report NESDIS/NODC-1, http://www.ngdc.noaa.gov/seg/WMM/dala/TRWMM_2005.pdf.