Technology and application of electro-depositable photo resists to create uniform coatings needed for complex 3D micro actuators and sensors

Microsystem Technologies

Volumn 13, Issue 5-6, 2007, Pages 557-562

  Feldmann, M ^a   Waldschik, A ^a   Buttgenbach S ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTRODEPOSITION; ELECTROPLATING; MICROACTUATORS; MICROSENSORS; PRINTED CIRCUIT BOARDS;

ELECTROPLATING CONDUCTORS; HELICAL COILS; NON-STRUCTURED WAFERS;

PHOTORESISTS;

EID: 33847279306     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0199-7     Document Type: Article

References (6)

1. Boellaard E, Pham NP, van den Brekel LDM, Burghartz JN (2001) RF-devices realized in MEMS by using electro-depositable photoresist. In: Proceedings of SAFE 2001 vol. 28-29, pp 1-7
2. Büttgenbach S, Feldmann M, Seidemann V (2004) Fabrication of high aspect ratio micro components using UV depth lithography and 3D microforming. In: Proceedings of the 12th international workshop on the physics of semiconductor devices, pp 229-238
3. Feldmann M, Büttgenbach S (2003) A novel fabrication technique using UV-lithography for polymer magnets in micro actuators and generators. Proc Eurosensors XVII:1217-1220
4. Heschel M, Bouwstra S (1998) Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon. Sens Actuators A 70:75-80
5. Pham NP, Boellaard E, Burghartz JN (2004) Photoresist coating methods for integration of novel 3-D RF micro-structures. J Microelectromech Syst 13(3):49M99
6. Waldschik A, Feldmann M, Buttgenbach S (2005) A novel reluctance actuator employing an embedded ferromagnetic Foil. HARMST 2005 (in press)