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Volumn 11, Issue 5, 2007, Pages 639-646

Catalytic effect of Pd nanoparticles on electroless copper deposition

Author keywords

Activator; Electroless copper deposition; Electroless nickel deposition; Kinetics; Nanoparticle; Palladium; Surface modification

Indexed keywords

ACTIVATORS; ELECTROLESS COPPER DEPOSITION; ELECTROLESS NICKEL DEPOSITION; NANOPARTICLES;

EID: 33847272210     PISSN: 14328488     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10008-006-0216-x     Document Type: Article
Times cited : (20)

References (19)
  • 13
    • 0002314370 scopus 로고
    • The fundamental aspects of electroless nickel plating
    • Mallory GO, Hajdu JB eds, American Electroplaters and Surface Finishers Society, Orlando, pp
    • Mallory GO (1990) The fundamental aspects of electroless nickel plating, In: Mallory GO, Hajdu JB (eds) Electroless plating: fundamentals and applications. American Electroplaters and Surface Finishers Society, Orlando, pp 1-56
    • (1990) Electroless plating: Fundamentals and applications , pp. 1-56
    • Mallory, G.O.1
  • 18
    • 33847307476 scopus 로고    scopus 로고
    • Fundamentals of electrochemical deposition
    • Paunovic M, Schlesinger M (1998) Fundamentals of electrochemical deposition. Wiley, New York, pp 133-160
    • (1998) Wiley, New York , pp. 133-160
    • Paunovic, M.1    Schlesinger, M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.