Heat transfer analysis of micromachined thermal conductivity sensors

IEEE International Conference on Emerging Technologies and Factory Automation, ETFA

Volumn 2 2 OF 2 VOL, Issue , 2005, Pages 977-983

  Beigelbeck, Roman ^a   Kohl, Franz ^a   Kuntner, Jochen ^b   Jakoby, Bernhard ^b  

^a ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

^b VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSIVITY; SENSOR GEOMETRY; THERMAL SENSORS;

HEAT TRANSFER; MATHEMATICAL MODELS; MICROMACHINING; PARAMETER ESTIMATION; THERMAL CONDUCTIVITY;

SENSORS;

EID: 33847263117     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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