Debonding dynamics of pressure-sensitive adhesives: 3D block model

European Physical Journal E

Volumn 21, Issue 4, 2006, Pages 331-339

  Yamaguchi, T ^b   Doi, M ^a  

^a JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

47.55.dp Cavitation and boiling; 68.35.Np Adhesion

Indexed keywords

DEBONDING DYNAMICS; SEPARATION SPEED; STRESS-STRAIN CURVES; VISCOELASTIC SOLID MEDIUM;

ADHESION; ADHESIVES; BOILING LIQUIDS; CAVITATION; DEBONDING; MATHEMATICAL MODELS; PRESSURE EFFECTS; STRAIN RATE; VISCOELASTICITY;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 33847257422     PISSN: 12928941     EISSN: 1292895X     Source Type: Journal    
DOI: 10.1140/epje/i2006-10073-5     Document Type: Article

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