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Volumn 20, Issue 1, 2006, Pages 7-17
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Modeling on debonding dynamics of pressure-sensitive adhesives
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL BONDS;
COMPUTER SIMULATION;
MOLECULAR DYNAMICS;
PRESSURE EFFECTS;
STRAIN;
STRESSES;
THIN FILMS;
VISCOELASTICITY;
DEBONDING DYNAMICS;
MECHANICAL MODELS;
PRESSURE-SENSITIVE ADHESIVES (PSA);
THIN-FILM GEOMETRY;
ADHESIVES;
ADHESIVE AGENT;
ADHESION;
ARTICLE;
CHEMICAL MODEL;
CHEMISTRY;
COMPUTER SIMULATION;
ELASTICITY;
HARDNESS;
MATERIALS TESTING;
MATHEMATICS;
MECHANICAL STRESS;
OBJECT RELATION;
TENSILE STRENGTH;
VISCOSITY;
ADHESIVENESS;
ADHESIVES;
COMPUTER SIMULATION;
ELASTICITY;
HARDNESS;
MATERIALS TESTING;
MATHEMATICS;
MODELS, CHEMICAL;
OBJECT ATTACHMENT;
STRESS, MECHANICAL;
TENSILE STRENGTH;
VISCOSITY;
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EID: 33744743264
PISSN: 12928941
EISSN: 1292895X
Source Type: Journal
DOI: 10.1140/epje/i2005-10078-6 Document Type: Article |
Times cited : (49)
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References (44)
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