Semi-ellipse method for accounting for the pile-up contact area during nanoindentation with the Berkovich indenter

Scripta Materialia

Volumn 55, Issue 8, 2006, Pages 699-702

  Kese, K ^a   Li, Z C ^a,b  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Amorphous materials; Hardness; Metals; Nanoindentation; Pile up

Indexed keywords

AMORPHOUS MATERIALS; ELASTIC MODULI; INDENTATION; METALLIC GLASS; SILICON NITRIDE; SODIUM COMPOUNDS; TUNGSTEN CARBIDE;

NANOINDENTATION; PILE UP CONTACT PERIMETERS;

PILES;

EID: 33847240162     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.06.030     Document Type: Article

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