Optimised thermal and microwave packaging for wide-band gap transistors: Diamond & flip chip

GAAS 2005 Conference Proceedings - 13th European Gallium Arsenide and Other Compound Semiconductors Application Symposium

Volumn 2005, Issue , 2005, Pages 537-540

  Schaffauser, C ^a   Vendier, O ^a   Forestier, S ^a   Michard, F ^a   Geffroy, D ^a   Drevon, C ^a   Villemazet, J F ^a   Cazaux, J L ^a   Delage, S ^b   Roux, J L ^c  

^a THALES ALENIA SPACE   (France)

^b TRT   (France)

^c CNES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENERGY GAP; FLIP CHIP DEVICES; MICROWAVE DEVICES; SEMICONDUCTING GALLIUM ARSENIDE; THERMAL CYCLING; THERMOANALYSIS;

DIAMOND CARRIER; DIAMOND CIRCUITS; WIDE-BAND GAP (WBG) TRANSISTORS;

TRANSISTORS;

EID: 33847179482     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. C. Zweben, "Composite Materials and Mechanical Design", Mechanical Engineers' Handbook, Second Edition, Myer Kutz, Ed, John Wiley & Sons, Inc., New York, 1998 (In Press).
2. DA.Benson, R.T.Mitchell, M.R.Tuck,D.R.Adkins, D.W. Palmer, "Micro-Machined Heat pipes inSilicon MCM Substrates", IEEE 1996.
3. C.Gillot, A.Laï, M.Ivanova, C.Schaeffer, E. Fournier, "Experimental Study of a Flat Silicon Heat Pipe with Micro-capillary Grooves"