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Volumn 2, Issue , 2005, Pages 792-796
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Water solubility and diffusivity in BCB resins used in microelectronic packaging and sensor applications
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Author keywords
BCB; Diffusion in polymers; Humidity sensors; Wafer level packaging
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Indexed keywords
CAPACITANCE;
DIELECTRIC MATERIALS;
DIFFUSION;
MICROELECTRONIC PROCESSING;
RESINS;
SENSORS;
SOLUBILITY;
BCB RESINS;
MICROELECTRONIC PACKAGING;
POLYMER DIELECTRIC;
WATER SOLUBILITY;
ELECTRONICS PACKAGING;
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EID: 33847125242
PISSN: 10915281
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (10)
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References (8)
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