메뉴 건너뛰기




Volumn 185, Issue 1-3, 2007, Pages 2-16

Tool-based nanofinishing and micromachining

Author keywords

ELID grinding; Hybrid machining; Micro EDM; Micro turning; Tool based machining

Indexed keywords

COST EFFECTIVENESS; ELECTRIC DISCHARGES; LITHOGRAPHY; MICROMACHINING; NANOTECHNOLOGY; PRODUCTION CONTROL;

EID: 33847117598     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2006.03.121     Document Type: Article
Times cited : (84)

References (19)
  • 2
    • 0011464066 scopus 로고    scopus 로고
    • Three-dimensional nanostructure fabrication by focused-ion-beam chemical vapor deposition
    • (in Japanese)
    • Matsui S., Kaito T., Fujita J.-I., Ishida M., and Ochiai Y. Three-dimensional nanostructure fabrication by focused-ion-beam chemical vapor deposition. J. Jpn. Soc. Prec. Eng. 67 9 (2001) 1412-1415 (in Japanese)
    • (2001) J. Jpn. Soc. Prec. Eng. , vol.67 , Issue.9 , pp. 1412-1415
    • Matsui, S.1    Kaito, T.2    Fujita, J.-I.3    Ishida, M.4    Ochiai, Y.5
  • 3
    • 0033157046 scopus 로고    scopus 로고
    • Micro cutting in the micro lathe turning system
    • Lu Z., and Yoneyama T. Micro cutting in the micro lathe turning system. Int. J. Mach. Tools Manuf. 39 (1999) 1171-1183
    • (1999) Int. J. Mach. Tools Manuf. , vol.39 , pp. 1171-1183
    • Lu, Z.1    Yoneyama, T.2
  • 5
    • 33847141610 scopus 로고    scopus 로고
    • R. Murata, K. Okano, C. Tsutsumi, Grinding of structural ceramics, Milton C Shaw Grinding Symposium PED, vol. 16, 1985, pp. 261-272.
  • 6
    • 58149208117 scopus 로고
    • Mirror surface grinding of silicon wafers with electrolytic in-process dressing
    • Omori H., and Nakagawa T. Mirror surface grinding of silicon wafers with electrolytic in-process dressing. Ann. CIRP 39 1 (1990) 329-333
    • (1990) Ann. CIRP , vol.39 , Issue.1 , pp. 329-333
    • Omori, H.1    Nakagawa, T.2
  • 7
    • 0000267375 scopus 로고
    • Drilling of deep micro holes by EDM
    • Masuzawa T., Kuo C.L., and Fujino M. Drilling of deep micro holes by EDM. Ann. CIRP 38 (1989) 195-198
    • (1989) Ann. CIRP , vol.38 , pp. 195-198
    • Masuzawa, T.1    Kuo, C.L.2    Fujino, M.3
  • 8
    • 0027969939 scopus 로고
    • A combined electrical machining process for micronozzle fabrication
    • Masuzawa T., Kuo C.L., and Fujino M. A combined electrical machining process for micronozzle fabrication. Ann. CIRP 43 (1994) 189-192
    • (1994) Ann. CIRP , vol.43 , pp. 189-192
    • Masuzawa, T.1    Kuo, C.L.2    Fujino, M.3
  • 12
    • 0042410965 scopus 로고    scopus 로고
    • Cutting performance of diamond tools during ultra-precision turning of electroless nickel plated die materials
    • Pramanik A., Neo K.S., Rahman M., Li X.P., Sawa M., and Meada Y. Cutting performance of diamond tools during ultra-precision turning of electroless nickel plated die materials. J. Mater. Process. Technol. 140 1-3 (2003) 308-313
    • (2003) J. Mater. Process. Technol. , vol.140 , Issue.1-3 , pp. 308-313
    • Pramanik, A.1    Neo, K.S.2    Rahman, M.3    Li, X.P.4    Sawa, M.5    Meada, Y.6
  • 13
    • 0028428205 scopus 로고
    • Chip topography for ductile-regime machining of germanium
    • Blackley W.S., and Scattergood R.O. Chip topography for ductile-regime machining of germanium. ASME Trans. J. Eng. Ind. 116 (1994) 263-266
    • (1994) ASME Trans. J. Eng. Ind. , vol.116 , pp. 263-266
    • Blackley, W.S.1    Scattergood, R.O.2
  • 14
    • 0031644050 scopus 로고    scopus 로고
    • Diamond cutting of silicon with nanometric finish
    • Fang F.Z., and Venkatesh V.C. Diamond cutting of silicon with nanometric finish. Ann. CIRP 47 (1998) 45-49
    • (1998) Ann. CIRP , vol.47 , pp. 45-49
    • Fang, F.Z.1    Venkatesh, V.C.2
  • 16
    • 0043221529 scopus 로고    scopus 로고
    • Effect of tool edge geometry on the nanometric cutting of Ge
    • Lucca D.A., Chou P., and Hocken R.J. Effect of tool edge geometry on the nanometric cutting of Ge. Ann. CIRP 47 (1998) 475-478
    • (1998) Ann. CIRP , vol.47 , pp. 475-478
    • Lucca, D.A.1    Chou, P.2    Hocken, R.J.3
  • 17
    • 33847157615 scopus 로고    scopus 로고
    • K. Liu, X.P. Li, M. Rahman, K.S. Neo, C.C. Chan, X.D. Liu, A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers, Int. J. Adv. Manuf. Tech., in press.
  • 18
    • 0041909802 scopus 로고    scopus 로고
    • Nano-precision measurement of diamond tool edge radius for wafer fabrication
    • Li X.P., Rahman M., Liu K., Neo K.S., and Chan C.C. Nano-precision measurement of diamond tool edge radius for wafer fabrication. J. Mater. Process. Technol. 140 (2003) 358-362
    • (2003) J. Mater. Process. Technol. , vol.140 , pp. 358-362
    • Li, X.P.1    Rahman, M.2    Liu, K.3    Neo, K.S.4    Chan, C.C.5
  • 19
    • 0036810280 scopus 로고    scopus 로고
    • Improvement of form accuracy in hybrid machining of microstructure
    • Lim H.S., Senthil Kumar A., and Rahman M. Improvement of form accuracy in hybrid machining of microstructure. J. Electron. Mater. 31 10 (2002) 1032-1038
    • (2002) J. Electron. Mater. , vol.31 , Issue.10 , pp. 1032-1038
    • Lim, H.S.1    Senthil Kumar, A.2    Rahman, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.