A micromechanics-based model for micro-toughness estimation from dimple geometry measurements

Engineering Fracture Mechanics

Volumn 74, Issue 8, 2007, Pages 1323-1343

  Srinivasan, Kartik ^a   Kolednik, Otmar ^b   Siegmund, Thomas ^a  

^a PURDUE UNIVERSITY   (United States)

^b ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

Author keywords

Stereophotogrammetry; Toughness; Void coalescence; Void growth

Indexed keywords

COMPUTATIONAL MECHANICS; DUCTILE FRACTURE; FRACTURE TOUGHNESS; MATHEMATICAL MODELS; METALLIC MATRIX COMPOSITES; PHOTOGRAMMETRY; STEEL; VOID FRACTION;

DUCTILE FRACTURE SURFACES; STEREOPHOTOGRAMMETRY; VOID COALESCENCE; VOID GROWTH;

FRACTURE MECHANICS;

COMPUTATIONAL MECHANICS; DUCTILE FRACTURE; FRACTURE MECHANICS; FRACTURE TOUGHNESS; MATHEMATICAL MODELS; METALLIC MATRIX COMPOSITES; PHOTOGRAMMETRY; STEEL; VOID FRACTION;

EID: 33847067972     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2006.07.004     Document Type: Article

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