Ceramic microjet cooling device

Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006

Volumn 2006 A, Issue , 2006, Pages 263-270

  Natarajan, Govindarajan ^a   Bezama, R J ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CHANNEL FLOW; COMPUTER SIMULATION; HEAT CONVECTION; JETS; PRESSURE DROP;

CONVECTION COEFFICIENT; MICROCHANNEL FLOW; MULTILAYER CERAMIC TECHNOLOGY (MLC);

COOLING SYSTEMS;

EID: 33846967825     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/icnmm2006-96036     Document Type: Conference Paper

References (10)

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2. B. W. Webb and C. F. Ma, "Single-Phase Liquid Jet Impingement Heat Transfer", Adv. in Heat Transfer, v.26, pp. 105-217, 1995.
3. D. Berger, R. J. Bezama, W. L. Herren, B. Michel, and G. Natarajan, "High Performance Integrated MLC Cooling Device for High Power Density IC's and Method of Manufacturing", US Patent Application, 2005.
4. B. Michel, T. Brunschwiler, H. E. Rothuizen, U. Kloter, R. Linderman, "Cooling Device", European Patent Application, 2005.
5. G. Natarajan and J. N. Humenik, "3D Ceramic Microfluidic Device Manufacturing", iMEMS Conference, Singapore, May 2006 (accepted).
6. G. Natarajn, J. N. Humenik, M. Cranmer, "Method and Structure to Enable Fine Grid MLC Technology", US Patent Application, 2006.
7. J. U. Knickerbocker et al., IBM J. Res. & Dev 46(6), 779-804 (2002).
8. T. Brunschwiler, H. Rothuizen, M. Fabbri, U. Kloter, B. Michel, R.J. Bezama, G. Natarajan, "Direct Liquid Jet Impingement with Micron-sized Nozzle Array and Distributed Return Architecture", ITHERM 2006, San Diego, CA May 2006 (accepted).
9. G. P. Peterson and H. B. Ma, "Theoretical Analysis of the Maximum Heat Transport in Triangular Grooves: A Study of Idealized Micro Heat Pipes", HTD-Vol 317-1, pp. 185-192, IMECE 1995.
10. M. Lu, L. Mok and R. J. Bezama, "A vapor Chamber Using Graphite Foams as Wicks for Cooling High Heat Flux Electronics", Proceedings of IPACK2005, ASME InterPACK'05.