Wafer-bonded surface plasmon waveguides

Applied Physics Letters

Volumn 90, Issue 6, 2007, Pages

  Berini, Pierre ^a,b   Mattiussi, Greg ^b,c   Lahoud, Nancy ^b   Charbonneau, Robert ^b,d  

^a UNIVERSITY OF OTTAWA   (Canada)

^b Spectalis Corporation   (Canada)

^c Epocal Inc   (Canada)

^d DEFENCE RESEARCH AND DEVELOPMENT CANADA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; SURFACE PLASMON RESONANCE; WSI CIRCUITS;

PYREX WAFERS; WAFER BONDING;

OPTICAL WAVEGUIDES;

EID: 33846956763     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2468660     Document Type: Article

References (32)

1. H. Raether, Surface Plasmons on Smooth and Rough Surfaces and on Gratings (Springer, Berlin, 1988).
2. W. L. Barnes, J. Opt. A, Pure Appl. Opt. 8, S87 (2006).
3. W. L. Barnes, A. Dereux, and T. W. Ebbesen, Nature (London) 424, 824 (2003).
4. S. A. Maier and H. A. Atwater, J. Appl. Phys. 98, 011101 (2005).
5. P. Berini, Phys. Rev. B 61, 10484 (2000).
6. P. Berini, Phys. Rev. B 63, 125417 (2001).
7. R. Charbonneau, P. Berini, E. Berolo, and E. Lisicka-Shrzek, Opt. Lett. 25, 844 (2000).
8. R. Nikolajsen, K. Leosson, I. Salakhutdinov, and S. I. Bozhevolnyi, Appl. Phys. Lett. 82, 668 (2003).
9. P. Berini, R. Charbonneau, N. Lahoud, and G. Mattiussi, J. Appl. Phys. 98, 043109 (2005).
10. R. Charbonneau, N. Lahoud, G. Mattiussi, and P. Berini, Opt. Express 13, 977 (2005).
11. A. Boltasseva, T. Nikolajsen, K. Leosson, K. Kjaer, M. S. Larsen, and S. I. Bozhevolnyi, J. Lightwave Technol. 23, 413 (2005).
12. R. Charbonneau, C. Scales, I. Breukelaar, S. Fafard, N. Lahoud, G. Mattiussi, and P. Berini, J. Lightwave Technol. 24, 477 (2006).
13. A. Degiron and D. R. Smith, Opt. Express 14, 1611 (2006).
14. S. Jett́-Charbonneau, R. Charbonneau, N. Lahoud, G. Mattiussi, and P. Berini, Opt. Express 13, 4674 (2005).
15. A. Boltasseva, S. I. Bozhevolnyi, T. Søndergaard, T. Nikolajsen, and K. Leosson, Opt. Express 13, 4237 (2005).
16. T. Nikolajsen, K. Leosson, and S. I. Bozhevolnyi, Appl. Phys. Lett. 85, 5833 (2004).
17. T. Nikolajsen, K. Leosson, and S. I. Bozhevolnyi, Opt. Commun. 244, 455 (2005).
18. G. Gagnon, N. Lahoud, G. Mattiussi, and P. Berini, J. Lightwave Technol. 24, 4391 (2006).
19. S. Park and S. H. Song, Electron. Lett. 42, 402 (2006).
20. J.-C. Weeber, J. R. Krenn, A. Dereux, B. Lamprecht, Y. Lacroute, and J.-P. Goudonnet, Phys. Rev. B 64, 045411 (2001).
21. B. Lamprecht, J. R. Krenn, G. Schider, H. Ditlbacher, M. Salerno, N. Felidj, A. Leitner, and F. R. Aussenegg, Appl. Phys. Lett. 79, 51 (2001).
22. Q.-Y. Tong and U. Gösele, Semiconductor Wafer Bonding: Science and Technology (Wiley Interscience, Toronto, 1999).
23. J. Haisma, B. A. C. M. Spierings, U. K. P. Biermann, and A. A. van Gorkum, Appl. Opt. 33, 1154 (1994).
24. Y. Tomita, M. Sugimoto, and K. Eda, Appl. Phys. Lett. 66, 1484 (1995).
25. S. McMeekin, R. M. De La Rue, and W. Johnstone, J. Lightwave Technol. 10, 163 (1992).
26. M. Levy, R. M. Osgood, Jr., R. Liu, L. E. Cross, G. S. Cargill III, A. Kumar, and H. Bakhru, Appl. Phys. Lett. 73, 2293 (1998).
27. T. A. Ramadan, M. Levy, and R. M. Osgood, Jr., Appl. Phys. Lett. 76, 1407 (2000).
28. P. Rabiei and P. Gunter, Appl. Phys. Lett. 85, 4603 (2004).
29. G. Mattiussi, N. Lahoud, R. Charbonneau, and P. Berini, Proc. SPIE 5720, 173 (2005).
30. F. Pigeon, B. Biasse, and M. Zussy, Electron. Lett. 31, 792 (1995).
31. I. Breukelaar, R. Charbonneau, and P. Berini, J. Appl. Phys. 100, 043104 (2006).
32. See EPAPS Document No. E-APPLAB-90-042706 for a movie corresponding to the sequence of images shown on the left hand side of Fig.. This document can be reached via a direct link in the online article's HTML reference section or ria the EPAPS homepage (http://www.aip.org/pubservs/epaps.html).