A statistical study of Sn whisker population and growth during elevated temperature and humidity tests

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 4, 2006, Pages 246-251

  Su, Peng ^a   Howell, Jim ^a   Chopin, Sheila ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Corrosion; Electroplating; Lead free; Tin finish; Whisker growth

Indexed keywords

CORROSION; CRYSTAL GROWTH; ELECTROPLATING; HIGH TEMPERATURE TESTING; METAL FINISHING; STATISTICAL METHODS; TIN;

HUMIDITY TESTS; TIN FINISH; WHISKER GROWTH; WHISKER POPULATION;

CRYSTAL WHISKERS;

EID: 33846886963     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.887385     Document Type: Article

References (2)

1. Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes, May 2005, JEDEC standard JESD22A121.
2. P. Su et al., "Effects of reflow on the microstructure and whisker growth propensity of Sn finish," in Proc. 54th Electron. Compon. Technol. Conf., 2005, pp. 434-440.