Metal-organic atomic layer deposition of metals for applications in interconnect technology

ECS Transactions

Volumn 1, Issue 10, 2006, Pages 51-56

  Van Der Straten, O ^a   Rossnagel, S M ^a   Doyle, J P ^a   Rodbell, K P ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; FILM GROWTH; MORPHOLOGY; TANTALUM COMPOUNDS; THERMAL EFFECTS; THIN FILMS;

GROWTH RATE; PLASMA-ENHANCED METHODS; TANTALUM NITRIDE LAYERS;

RUTHENIUM COMPOUNDS;

EID: 33846813969     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2209329     Document Type: Conference Paper

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