Investigating the role of stress in SOG-filled shallow- trench-isolation structures of sub-70nm device

ECS Transactions

Volumn 1, Issue 11, 2006, Pages 117-124

  Das, A ^a   Klipp, A ^a   Sperlich, H P ^a   Nitsche, R ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMISTRY; ETCHING; GLASS; SHRINKAGE; SILICON WAFERS;

PERHYDRO-POLYSILAZANE; SHALLOW-TRENCH ISOLATION (STI); SPIN-ON GLASS (SOG);

STRESS ANALYSIS;

EID: 33846796322     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2218483     Document Type: Conference Paper

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