Inkjettable conductive adhesive for use in microelectronics and microsystems technology

Microelectronics Reliability

Volumn 47, Issue 2-3, 2007, Pages 331-334

  Kolbe, Jana ^a   Arp, Andreas ^b   Calderone, Francesco ^c   Meyer, Edouard Marc ^c   Meyer, Wilhelm ^b   Schaefer, Helmut ^a   Stuve, Manuela ^a  

^a FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

^b Microdrop Technologies   (Germany)

^c Metalor Technologies SA   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; INK; MICROELECTRONICS; ORGANIC SOLVENTS; SINTERING; VISCOSITY;

CONDUCTIVE ADHESIVES; ELECTRICALLY CONDUCTIVE INKS; MICROSYSTEMS TECHNOLOGY;

ADHESIVES;

EID: 33846616824     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.02.017     Document Type: Article

References (2)

1. Kamyshny A., Ben-Moshe M., Aviezer S., and Magdassi S. Ink jet printing of metallic nanoparticles and microemulsions. Macromol Rapid Commun 26 (2005) 281-288
2. Cibis Dominik, Currle Ulrike. Ink jet printing of conductive silver paths, second international workshop on ink jet printing of functional polymers and materials, 2005.