Identification of sub-resolution assist features that are susceptible to imaging through process

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6349 II, Issue , 2006, Pages

  Melvin III, Lawrence S ^a   Drapeau, Martin ^a   Huang, Jensheng ^a  

^a SYNOPSYS INC   (United States)

Author keywords

Optical proximity correction; Process model; Resolution enhancement technique; Subresolution assist feature

Indexed keywords

OPTICAL PROXIMITY CORRECTION (OPC); PHOTORESIST FILMS; RESOLUTION ENHANCEMENT TECHNIQUE; SUB-RESOLUTION ASSIST FEATURES (SRAF);

ETCHING; IMAGING SYSTEMS; MATHEMATICAL MODELS; PHOTOLITHOGRAPHY; PHOTORESISTS; WSI CIRCUITS;

FEATURE EXTRACTION;

EID: 33846590568     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.692464     Document Type: Conference Paper

References (4)

1. Bruce W. Smith and Dale E. Ewbank, "OPC and image optimization using localized frequency analysis,"
2. Proceedings of SPIE - Volume 4691Optical Microlithography XV, Anthony Yen, Editor, July 2002, pp. 148-157
3. Shih Chieh Lo, L. K. Hsieh, J. B. Yeh, Y.-C. Pai, Will Tseng, Mahatma Lin and Ingrid B. Peterson, "Identifying process window marginalities of reticle designs for 0.15/0.13-μm technologies", Proceedings of SPIE - Volume 5130 Photomask and Next-Generation Lithography Mask Technology X, Hiroyoshi Tanabe, Editor, August 2003, pp. 829-837.
4. Jason Shieh, Robert Socha, Xuelong Shi, and Alek Chen,: A proposal for the contact hole assist feature printing checker in IML," Proceedings of SPIE - Volume 5853 Photomask and Next-Generation Lithography Mask Technology XII, Masanori Komuro, Editor, June 2005, pp. 672-677