Role of titanium on the reactive spreading of lead-free solders on alumina

Journal of Materials Research

Volumn 21, Issue 12, 2006, Pages 3222-3233

  Gremillard, Laurent ^a,b   Saiz, Eduardo ^a   Radmilovic, Velimir R ^a   Tomsia, Antoni P ^a  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^b UNIVERSITÉ DE LYON   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ADSORPTION; ALUMINA; CONTACT ANGLE; DISSOLUTION; INTERFACES (MATERIALS); MOLTEN MATERIALS; SOLDERING ALLOYS; WETTING;

LEAD-FREE SOLDERS; REACTIVE SPREADING; SOLID-LIQUID INTERFACE;

TITANIUM;

EID: 33846333854     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0393     Document Type: Article

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