Single diamond dressing characteristics of CMP polyurethane pad

Key Engineering Materials

Volumn 329, Issue , 2007, Pages 151-156

  Liao, Y S ^a   Tsai, M Y ^a   Sung, J C ^b   Pai, Y L ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b KINIK Company   (Taiwan)

Author keywords

Chemical mechanical polishing; Diamond conditioner; Polyurethane pad

Indexed keywords

CHEMICAL POLISHING; CUTTING TOOLS; POLYURETHANES; TOPOLOGY; WHEEL DRESSING;

CUTTING ACTION; DIAMOND CONDITIONER; POLYURETHANE PAD; SPRING BACK;

DIAMONDS;

EID: 33846286450     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-416-2.151     Document Type: Article

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