Effect of substrate etching on electrical properties of electrochemically deposited CuO

Journal of the Electrochemical Society

Volumn 154, Issue 2, 2007, Pages

  Wang, Longcheng ^a   Han, Kunee ^a   Tao, Meng ^a,b  

^a University of Texas at Arlington   (United States)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTRODEPOSITION; ELECTRONIC PROPERTIES; ETCHING; OPTIMIZATION; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS;

CHEMICAL ETCHING; ELECTROCHEMICAL ETCHING PROCESSES; ELECTROCHEMICALLY DEPOSITED;

COPPER OXIDES;

EID: 33846202585     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2404913     Document Type: Article

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