Diffusion bonding of γ-TiAl alloy to Ti-6Al-4V alloy under hot pressure

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 16, Issue 5, 2006, Pages 1059-1063

  Wang, Xiu Feng ^a   Ma, Mo ^a   Liu, Xue Bin ^a   Wu, Xue Qing ^a   Tan, Chao Gui ^a   Shi, Rong Kai ^a   Lin, Jian Guo ^a  

^a XIANGTAN UNIVERSITY   (China)

Author keywords

Diffusion bonding; Microstructure; Ti 6Al 4V alloys; TiAl alloys

Indexed keywords

ALUMINUM ALLOYS; BONDING; ENERGY DISPERSIVE SPECTROSCOPY; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY;

DIFFUSION BONDING; HOT PRESSURE;

TITANIUM ALLOYS;

EID: 33846131302     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(06)60377-4     Document Type: Article

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