A novel approach to the solid bonding of a TiAl alloy

Journal of Materials Science Letters

Volumn 20, Issue 18, 2001, Pages 1671-1673

  Lin, J G ^a   Yu, G S ^a   Wu, G Q ^b   Huang, Z ^b  

^a XIANGTAN UNIVERSITY   (China)

^b BEIHANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL BONDS; DUCTILITY; ELECTRON BEAMS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

SOLID BONDING;

TITANIUM ALLOYS;

EID: 0035885569     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1012417201722     Document Type: Article

References (6)