Tin pest in tin-rich solders

Advanced Packaging

Volumn 15, Issue 9, 2006, Pages 32-34

  Rinne, Glenn A ^a,b  

^a Unitive Electronics Inc

^b Unitive Electronics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARTILLERY ORDNANCE; MECHANICAL INTEGRITY;

FREE ENERGY; PHASE TRANSITIONS; STRESSES; THERMOANALYSIS; TIN;

SOLDERING ALLOYS;

FREE ENERGY; SOLDERING; STRESSES; THERMAL ANALYSIS; TIN;

EID: 33846069576     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

1. Hanson, A.C., Inman, G.O., Limitations of Tin as a Packing Material: Allotropie Transformation, Industrial and Engineering Chemistry, vol. 31, no. 6, pp 662-663, June 1939.
2. Minard, C. J. Carte figurative des pertes successives en hommes de l'armée française dans la campagne de Russie, 1812-1813, 20 November 1869. ENPC: Fol 10975, 10974/C612. From Friendly, M., The Graphic Works of Charles Joseph Minard, 2006, http://www. math.yorku.ca/SCS/Gallery/minbib. html.
3. Kariya, Y., Williams, N., Gagg, C., Plumbridge, W., Tin Pest in Sn-0.5 wt.% Cu Lead-Free Solder, MRS Journal of Materials, June 2001.
4. Kariya, Y., Gagg, C., Plumbridge, W., Tin Pest in Lead-free Solder, Soldering and Surface Mount Technology, V. 13, no. 1, pp. 39-40, 2000.
5. Porter, D.A., Easterling, K.E., Phase Transformation in Metals and Alloys, Van Nostrand Reinhold, New York, 1981.
6. Warnes, W.H., http://oregonstate.edu/instruct/ me482/Homework/W06/ ME482Hmwk4.html.