Smart and sequential approach to numerical prototyping in micro-electronic applications

Journal of Microelectronics and Electronic Packaging

Volumn 2, Issue 1, 2005, Pages 1-7

  Wymyslowski A ^a   Van Driel, W D ^b   Zhang, G Q ^c   Van De Peer, J ^d   Tzannetakis, N ^d  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b NXP SEMICONDUCTORS   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

^d LMS Numerical Technologies   (Belgium)

Author keywords

Design of experiments; Electronic packaging; Numerical simulation; Response surface modeling; Virtual prototyping

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; ITERATIVE METHODS; OPTIMIZATION; SOFTWARE PROTOTYPING;

DESIGN OF EXPERIMENTS; RESPONSE SURFACE MODELING; VIRTUAL PROTOTYPING;

MICROELECTRONICS;

EID: 33846024012     PISSN: None     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-2.1.1     Document Type: Article

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