Thermal shock behavior of a three-dimensional SiC/SiC composite

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 37, Issue 12, 2006, Pages 3587-3592

  Wu, Shoujun ^a   Cheng, Laifei ^a   Zhang, Litong ^a   Xu, Yongdong ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; BENDING STRENGTH; QUENCHING; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; THERMAL STRESS;

MICRODAMAGE PROCESSES; THERMAL SHOCK DAMAGE; WATER-QUENCHED METHOD;

COMPOSITE MATERIALS;

EID: 33845978068     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-006-1053-3     Document Type: Article

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