Interface and thermal shock resistance of SiC fiber/SiC composites

Scripta Materialia

Volumn 39, Issue 11, 1998, Pages 1593-1598

  Park, K ^a   Vasilos, T ^b  

^a Chungju National University   (South Korea)

^b University of Massachusetts   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BENDING STRENGTH; FRACTURE TOUGHNESS; HOT PRESSING; INTERFACES (MATERIALS); METALLIC MATRIX COMPOSITES; MICROSTRUCTURE; POROSITY; SILICON CARBIDE; THERMAL EXPANSION; THERMAL STRESS; TRANSMISSION ELECTRON MICROSCOPY;

INTERFACIAL BOND; THERMAL EXPANSION COEFFICIENT; THERMAL SHOCK RESISTANCE;

FIBER REINFORCED MATERIALS;

EID: 0032480660     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(98)00356-X     Document Type: Article

References (10)

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8. J. DiCarlo, J. Mater. Sci. 21, 217 (1991).
9. R. W. Goettler and K. T. Faber, Compos. Sci. Technol. 37, 129 (1989).
10. J. Bright, S. Danchaivijit, and D. Shetty, J. Am. Ceram. Soc. 74, 114 (1991).